Company profile · Semiconductors
台灣積體電路製造股份有限公司 · 2330
Drafted and translated from cited sources, with links to the passages they are based on for your verification. Care is taken to translate its original meaning from Mandarin as closely as possible.
TSMC engages in the manufacturing and selling of integrated circuits based on customer orders and product design specifications.[1]
The company's technologies are optimized for high-performance computing, smartphone, and artificial intelligence applications.[2]
Its 3nm technology entered volume production for customers' smartphone and high-performance computing products.[2]
| Latest month | Revenue | Year on year | Month on month |
|---|---|---|---|
| 2026-10 | NT$586.9bn | +59.7% | +14.7% |
2024-11 to 2026-10, monthly revenue.
| Last 20 trading days | Net |
|---|---|
| 2026-10-12 to 2026-11-10 | −NT$585.4bn |
Net buying (green) and selling (red) by foreign investors, NT$ at each day's close. All companies.
| Customers (34) | Advanced Micro Devices, Allegro Microsystems, Ambarella, Ambiq Micro, Analog Devices, Arteris, Astera Labs, Broadcom, Butterfly Network, Cirrus Logic, Credo Technology Group, Fortinet, GCT Semiconductor, GSI Technology, Himax Technologies and 19 more |
|---|---|
| Suppliers (5) | Entegris, Formfactor, KLA, LAM Research, Qnity Electronics |
| Competitors (3) | ASE Technology, Globalfoundries, SkyWater Technology |
| Partners (5) | ASE Technology, Globalfoundries, NXP Semiconductors, Semilux International, Sony Group |
Links stated in US annual reports and reviewed before publication. See the map and the quoted filings.
| Full English name | Taiwan Semiconductor Manufacturing Co., Ltd. |
|---|---|
| Chinese name | 台灣積體電路製造股份有限公司 |
| Stock code | 2330 (TWSE) |
| Industry | Semiconductors |
| Founded | 21 Feb 1987 |
| Listed | 05 Sep 1994 |
| Paid-in capital | NT$259.3bn |
| Chairman | 魏哲家 |
| President | 總裁: 魏哲家 |
| Headquarters | No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Hsin-Chu 300096, Taiwan, R.O.C. |
| Website | https://www.tsmc.com |
| Official business description | 依客戶之訂單與其提供之產品設計說明,以從事製造與銷售積體電路 · 以及其他晶圓半導體裝置。提供前述產品之封裝與測試服務、積體電 · 路之電腦輔助設計技術服務。提供製造光罩及其設計服務。 |
Facts from MOPS company basic information, retrieved 02 Nov 2026. The official business description is the company's own entry and can be out of date.
Generated 2026-11-11 00:39.