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Company profile · Semiconductors

Winbond

華邦電子股份有限公司 · 2344

What it does

Drafted and translated from cited sources, with links to the passages they are based on for your verification. Care is taken to translate its original meaning from Mandarin as closely as possible.

Winbond makes code storage flash memory, customized memory solutions, and logical chips through its subsidiary Nuvoton Technology Corporation.[1]

Its flash memory products are used for code and data storage and execution, with applications in personal computers, servers, data centers, mobile devices, healthcare, networking, smart IoT, consumer electronics, automotive, and industrial electronics.[1]

The company's customized memory solutions include customized ultra-bandwidth elements, specialty memory, and mobile memory for applications such as edge AI computing, CPU chiplets, 3C products, and wearable devices.[1]

Its logic chips, produced by Nuvoton, include microcontrollers, audio products, cloud computing products, image sensing, and battery management.[1]

Monthly revenue

Latest monthRevenueYear on yearMonth on month
2026-10NT$29.4bn+257.0%+3.9%
2024-11: NT$6.22bn2024-12: NT$6.37bn2025-01: NT$6.07bn2025-02: NT$6.35bn2025-03: NT$7.57bn2025-04: NT$6.82bn2025-05: NT$7.09bn2025-06: NT$7.11bn2025-07: NT$6.84bn2025-08: NT$7.01bn2025-09: NT$7.92bn2025-10: NT$8.23bn2025-11: NT$8.63bn2025-12: NT$9.77bn2026-01: NT$11.78bn2026-02: NT$11.97bn2026-03: NT$14.50bn2026-04: NT$19.25bn2026-05: NT$20.00bn2026-06: NT$20.60bn2026-07: NT$26.77bn2026-08: NT$27.31bn2026-09: NT$28.25bn2026-10: NT$29.36bn

2024-11 to 2026-10, monthly revenue.

Foreign investors

Last 20 trading daysNet
2026-10-12 to 2026-11-10−NT$5.4bn
2026-10-12: −NT$580m2026-10-13: −NT$6.0bn2026-10-14: +NT$1.8bn2026-10-15: −NT$2.9bn2026-10-16: +NT$2.0bn2026-10-19: −NT$1.7bn2026-10-20: +NT$65m2026-10-21: +NT$1.9bn2026-10-22: −NT$264m2026-10-27: +NT$3.7bn2026-10-28: +NT$4.4bn2026-10-29: +NT$2.4bn2026-10-30: −NT$524m2026-11-02: −NT$678m2026-11-03: −NT$5.4bn2026-11-04: −NT$1.8bn2026-11-05: −NT$1.7bn2026-11-06: +NT$708m2026-11-09: +NT$378m2026-11-10: −NT$1.1bn

Net buying (green) and selling (red) by foreign investors, NT$ at each day's close. All companies.

Supply chain

Customers (1)Everspin Technologies
Suppliers (1)Rambus

Links stated in US annual reports and reviewed before publication. See the map and the quoted filings.

Facts

Full English nameWinbond Electronics Corporation
Chinese name華邦電子股份有限公司
Stock code2344 (TWSE)
IndustrySemiconductors
Founded29 Sep 1987
Listed18 Oct 1995
Paid-in capitalNT$45.0bn
Chairman焦佑鈞
President陳沛銘
HeadquartersNo.8, Keya 1st Rd., Daya Dist., Taichung City, Taiwan, R.O.C
Websitehttps://WWW.WINBOND.COM
Official business description1積體電路2半導體記憶零組件及其系統產品3電腦系統用、數位通訊 · 用、及週邊設備用之半導體零組件及其系統產品4其他半導體零組件 · 5電腦軟體程式設計及資料處理6兼營與業務相關之進出口貿易業務

Facts from MOPS company basic information, retrieved 02 Nov 2026. The official business description is the company's own entry and can be out of date.

Sources

  1. Annual report 2025 (Chinese), business scope · annual_report · retrieved 03 Nov 2026
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Generated 2026-11-11 00:39.