Company profile · Semiconductors
欣銓科技股份有限公司 · 3264
Drafted and translated from cited sources, with links to the passages they are based on for your verification. Care is taken to translate its original meaning from Mandarin as closely as possible.
Ardentec provides wafer testing of memory IC, wafer and final testing of digital signal IC and mixed-signal IC, wafer testing of high-performance analog IC, and wafer and final testing of radio-frequency IC.[1]
The company also offers burn-in testing of wafer types, laser repair and trimming services, CMOS Image Sensor wafer and product testing, software design services, and electronic component manufacturing.[2]
Additional business activities include the wholesale and retail of electronic materials, international trade, development of testing technologies for SoC, Embedded IC, and IC testing technologies, as well as product analysis.[2]
| Latest month | Revenue | Year on year | Month on month |
|---|---|---|---|
| 2026-10 | NT$1.9bn | +47.9% | +4.6% |
2024-11 to 2026-10, monthly revenue.
| Last 20 trading days | Net |
|---|---|
| 2026-10-12 to 2026-11-10 | −NT$8.7bn |
Net buying (green) and selling (red) by foreign investors, NT$ at each day's close. All companies.
| Full English name | Ardentec Corporation |
|---|---|
| Chinese name | 欣銓科技股份有限公司 |
| Stock code | 3264 (TPEx) |
| Industry | Semiconductors |
| Founded | 11 Oct 1999 |
| Listed | 05 Jan 2005 |
| Paid-in capital | NT$4.9bn |
| Chairman | 盧志遠 |
| President | 王進明 |
| Headquarters | No.3, Gongye 3rd Rd., Shengli Vil.,Hukou Township, Hsinchu County 303, Taiwan |
| Website | https://www.ardentec.com |
| Official business description | 記憶體IC之晶圓測試 · 數位訊號IC及混合訊號IC之晶圓及成品測試 · 晶圓型式之Burn in 之測試 |
Facts from MOPS company basic information, retrieved 03 Nov 2026. The official business description is the company's own entry and can be out of date.
Generated 2026-11-11 00:39.