Company profile · Semiconductors
台星科股份有限公司 · 3265
Drafted and translated from cited sources, with links to the passages they are based on for your verification. Care is taken to translate its original meaning from Mandarin as closely as possible.
Winstek Semiconductor provides integrated circuit testing, wafer bumping, flip chip packaging, and wafer-level packaging services.[1]
The company also offers product reliability verification services, failure analysis services, and wafer grinding and dicing services.[1]
Additionally, it engages in the design, processing, packaging, and trading of integrated circuits and related accessories.[1]
| Latest month | Revenue | Year on year | Month on month |
|---|---|---|---|
| 2026-10 | NT$399m | -3.2% | -0.1% |
2024-11 to 2026-10, monthly revenue.
| Last 20 trading days | Net |
|---|---|
| 2026-10-12 to 2026-11-10 | +NT$1.2bn |
Net buying (green) and selling (red) by foreign investors, NT$ at each day's close. All companies.
| Full English name | Winstek Semiconductor Co., Ltd. |
|---|---|
| Chinese name | 台星科股份有限公司 |
| Stock code | 3265 (TPEx) |
| Industry | Semiconductors |
| Founded | 26 Apr 2000 |
| Listed | 02 Aug 2005 |
| Paid-in capital | NT$1.4bn |
| Chairman | 黃興陽 |
| President | 翁志立 |
| Headquarters | NO 176-5, LU LIAO KEN, 6 LING, HUA LUNG CHUN, CHIUNG LIN, HSIN-CHIU HSIEN, TAIWAN, |
| Website | https://www.winstek.com.tw/html/home/index-tw.html |
| Official business description | 積體電路,IC 及其測試機組之研發及測試 · 資訊軟體服務業 · 電子零組件製造業 |
Facts from MOPS company basic information, retrieved 03 Nov 2026. The official business description is the company's own entry and can be out of date.
Generated 2026-11-11 00:39.