Company profile · Semiconductors
Xintec
精材科技股份有限公司 · 3374
What it does
Drafted and translated from cited sources, with links to the passages they are based on for your verification. Care is taken to translate its original meaning from Mandarin as closely as possible.
Xintec provides test services, wafer level packaging, and wafer level post passivation interconnection.[1]
The company offers wafer level chip scale packaging for image sensors, optical sensors, inertial sensors, and biometric sensors.[1]
Its wafer level post passivation interconnection services cover image sensors and micro-electro-mechanical systems speakers, alongside 300mm wafer chip probing and final testing.[1]
Monthly revenue
| Latest month | Revenue | Year on year | Month on month |
|---|---|---|---|
| 2026-10 | NT$989m | +39.0% | +6.1% |
2024-11 to 2026-10, monthly revenue.
Foreign investors
| Last 20 trading days | Net |
|---|---|
| 2026-10-12 to 2026-11-10 | +NT$275m |
Net buying (green) and selling (red) by foreign investors, NT$ at each day's close. All companies.
Facts
| Full English name | Xintec Inc. |
|---|---|
| Chinese name | 精材科技股份有限公司 |
| Stock code | 3374 (TPEx) |
| Industry | Semiconductors |
| Founded | 11 Sep 1998 |
| Listed | 30 Mar 2015 |
| Paid-in capital | NT$2.7bn |
| Chairman | 陳家湘 |
| President | 陳家湘 |
| Headquarters | 9FL., No.23, Jilin Road, Zhongli District Taoyuan City, Taiwan, R.O.C. |
| Website | https://www.xintec.com.tw |
| Official business description | 測試服務 · 晶圓級尺寸封裝業務 · 晶圓級後護層封裝業務 |
Facts from MOPS company basic information, retrieved 03 Nov 2026. The official business description is the company's own entry and can be out of date.
Sources
- Annual report 2025 (English), business scope · annual_report · retrieved 03 Nov 2026
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