Company profile · Semiconductors
Chipbond Technology
頎邦科技股份有限公司 · 6147
What it does
Drafted and translated from cited sources, with links to the passages they are based on for your verification. Care is taken to translate its original meaning from Mandarin as closely as possible.
Chipbond Technology provides packaging and testing services for integrated circuits, specializing in display driver ICs and non-driver IC solutions.[1]
Its main services and products include gold bumping, tin-lead bumping, wafer probing and testing, Chip on Film, Chip on Glass, and Wafer Level Chip Scale Packaging.[2]
The company also offers compound semiconductor-related bumping and packaging processes, flexible tape-and-reel circuit substrates, and chip trays.[3]
It serves customers in various fields such as display technology, wireless communication, power management, automotive electronics, and biomedicine.[3]
Headquartered in Hsinchu Science Park, the company operates with its headquarters in Taiwan.[3]
Monthly revenue
| Latest month | Revenue | Year on year | Month on month |
|---|---|---|---|
| 2026-10 | NT$2.4bn | +33.0% | -0.1% |
2024-11 to 2026-10, monthly revenue.
Foreign investors
| Last 20 trading days | Net |
|---|---|
| 2026-10-12 to 2026-11-10 | −NT$5.1bn |
Net buying (green) and selling (red) by foreign investors, NT$ at each day's close. All companies.
Facts
| Full English name | CHIPBOND TECHNOLOGY CORPORATION |
|---|---|
| Chinese name | 頎邦科技股份有限公司 |
| Stock code | 6147 (TPEx) |
| Industry | Semiconductors |
| Founded | 02 Jul 1997 |
| Listed | 31 Jan 2002 |
| Paid-in capital | NT$7.4bn |
| Chairman | 吳非艱 |
| President | 施政宏 |
| Headquarters | No 3,Li Hsin 5 Rd.,Science-Based Industrial Park Hsinchu,Taiwan,R.O.C. |
| Website | https://www.chipbond.com.tw |
| Official business description | 金凸塊(GOLD BUMPING)，錫鉛凸塊(SOLD BUMPING)，晶圓測試(CP) · 捲帶軟板封裝(TCP)，捲帶式薄膜覆晶(COF)，玻璃覆晶封裝(COG) |
Facts from MOPS company basic information, retrieved 03 Nov 2026. The official business description is the company's own entry and can be out of date.
Sources
- Home Page | Chipbond · website · retrieved 03 Nov 2026
- MOPS 公司基本資料 頎邦科技股份有限公司 · mops · retrieved 03 Nov 2026
- About Chipbond | Chipbond · website · retrieved 03 Nov 2026
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