Company profile · Semiconductors
Formosa Advanced Technologies
福懋科技股份有限公司 · 8131
What it does
Drafted and translated from cited sources, with links to the passages they are based on for your verification. Care is taken to translate its original meaning from Mandarin as closely as possible.
Formosa Advanced Technologies provides contract packaging and testing operations for various types of integrated circuits, accounting for 74% of revenue, alongside module processing services that generate 26% of revenue.[1]
The company offers a wide range of packaging and testing services including DRAM, logic products, flash memory cards, embedded multimedia cards, and flip-chip chip scale packages.[2]
Additionally, it engages in the research, development, manufacture, and sales of implanted dissipative cathodes, magnetrons, precision engineering parts, and electronics components.[2]
The company is based in Toulin, Taiwan.[1]
Monthly revenue
| Latest month | Revenue | Year on year | Month on month |
|---|---|---|---|
| 2026-10 | NT$1.2bn | +30.2% | -5.6% |
2024-11 to 2026-10, monthly revenue.
Foreign investors
| Last 20 trading days | Net |
|---|---|
| 2026-10-12 to 2026-11-10 | −NT$245m |
Net buying (green) and selling (red) by foreign investors, NT$ at each day's close. All companies.
Facts
| Full English name | FORMOSA ADVANCED TECHNOLOGIES CO., LTD. |
|---|---|
| Chinese name | 福懋科技股份有限公司 |
| Stock code | 8131 (TWSE) |
| Industry | Semiconductors |
| Founded | 11 Sep 1990 |
| Listed | 29 Nov 2007 |
| Paid-in capital | NT$4.4bn |
| Chairman | 蘇林慶 |
| President | 張憲正 |
| Headquarters | NO.329,Ho-Nan St. Toulin, Taiwan, R.O.C. |
| Website | https://www.fatc.com.tw/ |
| Official business description | 接受委託各型積體電路之封裝、測試與模組之加工及研究開發業務 · CC01080電子零組件製造業 |
Facts from MOPS company basic information, retrieved 03 Nov 2026. The official business description is the company's own entry and can be out of date.
Sources
- MOPS 公司基本資料 福懋科技股份有限公司 · mops · retrieved 03 Nov 2026
- Annual report 2025 (English), business scope · annual_report · retrieved 03 Nov 2026
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