Company profile · Semiconductors
南茂科技股份有限公司 · 8150
Drafted and translated from cited sources, with links to the passages they are based on for your verification. Care is taken to translate its original meaning from Mandarin as closely as possible.
ChipMOS provides assembly and testing services for various integrated circuits, including memory products, LCD driver ICs, and logic and mixed-signal ICs.[1]
The company also offers turnkey total solutions, drop shipment services, and wafer bumping.[1]
Its packaging and testing services cover Multi-Chip Packages, thin small outline packages, BGAs, DFN and QFN, Chip On Film, Chip On Glass, Chip On Plastic, and WLCSP or Flip Chip.[1]
These assembly and testing services are applied to automotive, information, communications, mobile, wearable, consumer electronics, and other related products.[1]
| Latest month | Revenue | Year on year | Month on month |
|---|---|---|---|
| 2026-10 | NT$2.9bn | +30.9% | +2.1% |
2024-11 to 2026-10, monthly revenue.
| Last 20 trading days | Net |
|---|---|
| 2026-10-12 to 2026-11-10 | −NT$4.9bn |
Net buying (green) and selling (red) by foreign investors, NT$ at each day's close. All companies.
| Competitors (2) | ASE Technology, King Yuan Electronics |
|---|
Links stated in US annual reports and reviewed before publication. See the map and the quoted filings.
| Full English name | ChipMOS TECHNOLOGIES INC. |
|---|---|
| Chinese name | 南茂科技股份有限公司 |
| Stock code | 8150 (TWSE) |
| Industry | Semiconductors |
| Founded | 28 Jul 1997 |
| Listed | 11 Apr 2014 |
| Paid-in capital | NT$7.0bn |
| Chairman | 鄭世杰 |
| President | 鄭世杰 |
| Headquarters | No.1 R&D Rd.1,Hsinchu Science Park Hsinchu,Taiwan, R.O.C |
| Website | https://www.chipmos.com |
| Official business description | 研究開發生產製造銷售高集積度高精密度記憶體之封裝及測試服務 · 顯示器驅動IC封裝測試(含金凸塊)業務 · 混合訊號IC封裝測試業務 |
Facts from MOPS company basic information, retrieved 03 Nov 2026. The official business description is the company's own entry and can be out of date.
Generated 2026-11-11 00:39.